| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-178-6882 (011786882) |
| NCB Code | USA (01) |
| Manufacturer | Boeing Aerostructures Australia Pty Ltd, Integrated Device Technology Inc, Honeywell International Inc, Sgs Thompson Microelectronics Inc, Raytheon Company, Intel Corporation, Dla Land And Maritime, Arrow Fasteners Inc, Bae Systems Inc |
| Part Number | Manufacturer | Item Name | RFQ |
|---|---|---|---|
| 194482-1 | boeing aerostructures australia pty ltd | microcircuit memory | RFQ |
| 6168S70CB | integrated device technology inc | microcircuit memory | RFQ |
| 6405530-1 | honeywell international inc | microcircuit memory | RFQ |
| IMS1420S-70M | sgs thompson microelectronics inc | microcircuit memory | RFQ |
| 2690533-7 | raytheon company | microcircuit memory | RFQ |
| IDT6168SA70DB | integrated device technology inc | microcircuit memory | RFQ |
| 104462-001 | intel corporation | microcircuit memory | RFQ |
| 8500150-425 | honeywell international inc | microcircuit memory | RFQ |
| 5962-8670524RA | dla land and maritime | microcircuit memory | RFQ |
| 900653-2 | arrow fasteners inc | microcircuit memory | RFQ |
| 231304-001 | bae systems inc | microcircuit memory | RFQ |
| 5962-86705 | dla land and maritime | microcircuit memory | RFQ |
| 231394-001 | bae systems inc | microcircuit memory | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.985 INCHES MINIMUM AND 1.015 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.300 INCHES MINIMUM AND 0.320 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.088 INCHES MINIMUM AND 0.108 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND MONOLITHIC AND HERMETICALLY SEALED |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 18 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 67268-5962-86705 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
| Relevant Components for NSN - 5962-01-178-6882, 5962011786882 | ||||
| 5920-01-337-7645 (5920013377645) | 5995-01-688-0358 (5995016880358) | 5935-01-132-7705 (5935011327705) | 5910-00-152-4145 (5910001524145) | |
| 5945-01-363-9722 (5945013639722) | 5975-01-032-9067 (5975010329067) | 5998-01-433-6008 (5998014336008) | 5970-01-298-0394 (5970012980394) | |
| 5998-01-674-4887 (5998016744887) | 5935-01-294-4644 (5935012944644) | 5975-01-216-8288 (5975012168288) | 5915-00-412-1691 (5915004121691) | |
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