| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-262-9858 (012629858) |
| NCB Code | USA (01) |
| Manufacturer | Dla Land And Maritime, Philips Semiconductors Ltd, Intel Corporation, Texas Instruments Inc, Harris Corporation, Incon Inc, Seeq Technology Inc, Waferscale Integration Inc, Advanced Micro Devices Inc, Boeing Company The |
| Part Number | Manufacturer | Item Name | RFQ |
|---|---|---|---|
| 5962-8606301XX | dla land and maritime | microcircuit memory | RFQ |
| 5962-86063 | dla land and maritime | microcircuit memory | RFQ |
| 27C256-BXA-20 | philips semiconductors ltd | microcircuit memory | RFQ |
| MD27C256 20 B | intel corporation | microcircuit memory | RFQ |
| TMS27C256-20 | texas instruments inc | microcircuit memory | RFQ |
| I25-0022-002 | harris corporation | microcircuit memory | RFQ |
| AM27C256-200DC | incon inc | microcircuit memory | RFQ |
| DM27C256-200 | seeq technology inc | microcircuit memory | RFQ |
| 5962-8606301XB | dla land and maritime | microcircuit memory | RFQ |
| WS27C256L-20DMB | waferscale integration inc | microcircuit memory | RFQ |
| MD27C256 20 B | advanced micro devices inc | microcircuit memory | RFQ |
| 5962-8606301XA | dla land and maritime | microcircuit memory | RFQ |
| SMJ27C256-20JM | texas instruments inc | microcircuit memory | RFQ |
| 477-2872-002 | boeing company the | microcircuit memory | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.375 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.500 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 275.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE |
| CQSJ | INCLOSURE MATERIAL | METAL OR CERAMIC OR PLASTIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 23 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.5 VOLTS MAXIMUM INPUT |
| CZER | MEMORY DEVICE TYPE | EPROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| Relevant Components for NSN - 5962-01-262-9858, 5962012629858 | ||||
| 5920-01-337-7645 (5920013377645) | 5995-01-688-0358 (5995016880358) | 5935-01-132-7705 (5935011327705) | 5910-00-152-4145 (5910001524145) | |
| 5945-01-363-9722 (5945013639722) | 5975-01-032-9067 (5975010329067) | 5998-01-433-6008 (5998014336008) | 5970-01-298-0394 (5970012980394) | |
| 5998-01-674-4887 (5998016744887) | 5935-01-294-4644 (5935012944644) | 5975-01-216-8288 (5975012168288) | 5915-00-412-1691 (5915004121691) | |
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